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1

Bottom-Up Engineering of Subnanometer Copper Diffusion Barriers Using NH2-Derived Self-Assembled Monolayers

Arantxa Maestre Caro, Silvia Armini, Olivier Richard, Guido Maes, Gustaaf Borghs, Caroline M. Whelan, Youssef Travaly

Journal:

Advanced Functional Materials

Year:

2010

Language:

english

File:

PDF, 673 KB

english, 2010

2

Temperature insensitive conductance detection with surface-functionalised silicon nanowire sensors

Mohammad Adel Ghiass, Silvia Armini, Marta Carli, Arantxa Maestre Caro, Vladimir Cherman, Jun Ogi, Shunri Oda, Zakaria Moktadir, Yoshishige Tsuchiya, Hiroshi Mizuta

Journal:

Microelectronic Engineering

Year:

2011

Language:

english

File:

PDF, 510 KB

english, 2011

3

Screening self-assembled monolayers as Cu diffusion barriers

A. Maestre Caro, G. Maes, G. Borghs, C.M. Whelan

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 236 KB

english, 2008

4

High Quality NH2SAM (Self Assembled Monolayer) Diffusion Barrier for Advanced Copper Interconnects

Maestre Caro, Arantxa, Zhao, L., Maes, Guido, Borghs, Gustaaf, Beyer, Gerald, Tőkei, Zsolt, Armini, Silvia, Travaly, Youssef

Journal:

MRS Proceedings

Year:

2010

Language:

english

File:

PDF, 941 KB

english, 2010

5

Selective self-assembled monolayer coating to enable Cu-to-Cu connection in dual damascene vias

Maestre Caro, A., Travaly, Y., Beyer, G., Tokei, Z., Maes, G., Borghs, G., Armini, S.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 756 KB

english, 2013

6

Electrical properties of amino SAM layers studied with conductive AFM

Chintala, R., Eyben, P., Armini, S., Maestre Caro, A., Loyo, J., Sun, Y., Vandervorst, W.

Journal:

European Polymer Journal

Year:

2013

Language:

english

File:

PDF, 1.37 MB

english, 2013

7

[IEEE 2014 IEEE Symposium on VLSI Technology - Honolulu, HI, USA (2014.6.9-2014.6.12)] 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers - Process technology scaling in an increasingly interconnect dominated world

Clarke, James S., George, Christopher, Jezewski, Christopher, Caro, Arantxa Maestre, Michalak, David, Torres, Jessica

Year:

2014

Language:

english

File:

PDF, 383 KB

english, 2014

8

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules

Maestre Caro, A., Travaly, Y., Maes, G., Borghs, G., Armini, S.

Year:

2011

Language:

english

File:

PDF, 387 KB

english, 2011

9

[IEEE 2007 Digest of papers Microprocesses and Nanotechnology - Kyoto, Japan (2007.11.5-2007.11.8)] 2007 Digest of papers Microprocesses and Nanotechnology - Molecular engineering for future device structures: self-assembled monolayers as diffusion barriers for Cu metallization

Whelan, C.M., Caro, A. Maestre, Clemente, F., Beyer, G., Tokei, Z., Sutcliffe, V.

Year:

2007

Language:

english

File:

PDF, 638 KB

english, 2007

10

[IEEE TRANSDUCERS 2011 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference - Beijing, China (2011.06.5-2011.06.9)] 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference - Stiction-free poly-SiGe resonators for monolithic integration of biosensors with CMOS

Lenci, S., Pieri, F., Haspeslagh, L., De Coster, J., Decoutere, S., Maestre Caro, A., Armini, S., Witvrouw, A.

Year:

2011

Language:

english

File:

PDF, 1.05 MB

english, 2011

11

Materials Engineering for Future Interconnects: “Catalyst-Free” Electroless Cu Deposition on Self-Assembled Monolayer Alternative Barriers

Armini, S., Maestre Caro, A.

Journal:

Journal of The Electrochemical Society

Year:

2010

Language:

english

File:

PDF, 1.55 MB

english, 2010

12

Electroless Cu Deposition on Self-assembled Monolayer Alternative Barriers

Armini, Silvia, Maestre Caro, Arantxa

Journal:

MRS Proceedings

Year:

2009

Language:

english

File:

PDF, 949 KB

english, 2009

13

ECS Transactions [ECS China Semiconductor Technology International Conference 2011 (CSTIC 2011) - Shanghai, China (March 13 - March 14, 2011)] - Evaluation of Metallization Options for Advanced Cu Interconnects Application

Jourdan, Nicolas, Carbonell, Laureen, Heylen, Nancy, Swerts, Johan, Armini, S., Caro, A. Maestre, Demuynck, S., Croes, K., Beyer, G., Tökei, Zsolt, Elshocht, S. Van, Vancoille, E.

Year:

2011

Language:

english

File:

PDF, 657 KB

english, 2011